Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.

Other names for Semiconductor Processors: Charge Preparation Technician, Chemical Etch Operator, Circuit Recorder, Crystal Cutter, Crystal Finisher, Crystal Grower, Crystal Growing Technician, Crystal Lapper, Crystal Machining Coordinator, Crystal Mounter, Crystal Slicer, Device Processing Engineer, Die Attacher, Diffusion Furnace Operator, Diffusion Operator, Electronic Component Processor, Electronic Semiconductor Processor, Engineering Technician, Epitaxial Reactor Operator, Epitaxial Reactor Technician, Etcher, Fabrication Operator, Integrated Circuit Fabricator, Ion Implant Machine Operator, Lap Machine Tender, Lapping Machine Tender, Manufacture Specialist, Manufacturing Technician, Metalorganic Chemical Vapor Deposition Engineer (MOCVD Engineer), Microelectronics Technician, Printed Circuit Photographer, Probe Operator, Process Engineer, Process Technician, Resistor Coater, Seed Core Operator, Semi Conductor Assembler, Semiconductor Dies Loader, Semiconductor Lab Technician, Semiconductor Packages Sealer, Semiconductor Processing Equipment Test Technician, Semiconductor Processing Group Leader, Semiconductor Processor, Semiconductor Wafers Diffusion Furnace Operator, Semiconductor Wafers Etch Operator, Semiconductor Wafers Etcher-Stripper, Semiconductor Wafers Marker, Semiconductor Wafers Saw Operator, Semiconductors Metallization Equipment Tender, Semiconductors Wafer Breaker, Wafer Fabrication Operator, Wafer Machine Operator, Wafer Mounter, Wafer Polishing Worker, Wafer Production Worker,

• Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.
• Maintain processing, production, and inspection information and reports.
• Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.
• Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
• Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.
• Load and unload equipment chambers and transport finished product to storage or to area for further processing.
• Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.
• Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.
• Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.
• Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
• Load semiconductor material into furnace.
• Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.
• Count, sort, and weigh processed items.
• Calculate etching time based on thickness of material to be removed from wafers or crystals.
• Inspect equipment for leaks, diagnose malfunctions, and request repairs.
• Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.
• Stamp, etch, or scribe identifying information on finished component according to specifications.
• Operate saw to cut remelt into sections of specified size or to cut ingots into wafers.
• Scribe or separate wafers into dice.
• Connect reactor to computer, using hand tools and power tools.
• Mount crystal ingots or wafers on blocks or plastic laminate, using special mounting devices, to facilitate their positioning in the holding fixtures of sawing, drilling, grinding or sanding equipment.
• Attach ampoule to diffusion pump to remove air from ampoule, and seal ampoule, using blowtorch.
• Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.
• Locate crystal axis of ingot, and draw orientation lines on ingot, using x-ray equipment, drill, and sanding machine.